An external formation based on lithography processes is not a single possible method of the IC manufacturing. In the self-formation the interaction between the forming object and chaotic medium is controlled by the object's structure, and the structure is changed by the interactions accompanied by the primary object increasing complexity. Three kinds of self-formation methods can be used for manufacturing: self-alignment, based on the interaction between an object and distinct sequence of chaotic media, development, where a single chaotic medium is sufficient and reproduction, where the developing objects generates primary objects. There are known a lot of methods for submicrometer structures manufacturing and lithography processes reducing.